光罩制作 (Mask Manufacturing)

经由雷射/电子束描绘机将线路图描绘在石英/玻璃基板上,此基板(光罩),会借曝光机投影成像技术,将其线路图成像到晶圆或玻璃基板上。

Product

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

扩散及薄膜 / 离子植入(Diffusion & Thin Film)

扩散及薄膜(Diffusion & Thin Film)
用途广泛,应用于扩散、趋入、氧化、薄膜沉积、退火、热烧结
可分为常压、低压沉积、原子层薄膜沉积

离子植入(Ion Implanter)
离子布植:利用电场,将游离的原子或分子加速后,直接射入晶圆的过程
掺杂:在晶圆中加入其他元素,改变材料的导电特性

Product

Advanced Ion Beam Technology, Inc. (台湾)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

湿式蚀刻与清洁 (Wet Etch & Clean)

湿蚀刻
利用药液,将晶圆表面上的图形,做选择性地去除
可分为多反应槽式、单槽式、单晶圆式

清洁
要制作精密的硅晶圆产品,需要非常洁净的表面,才能质量极佳化

黄光微影涂布及显影 (Photo Lithography)

光阻涂布:去水烘烤、HMDS涂布、光阻涂布、软烤
曝光:以曝光机搭配光罩使用
显影:曝后烤、显影、硬烤

干式蚀刻 (Dry Etch)

利用气体作为反应物,以低压和高能的环境产生电浆,去除硅晶圆表面的薄膜,定义出图形。
可分为物理性、化学性、活性离子。

化学机械研磨 (Chemical-Mechanical Planarization)

将晶片表面之突出部分,藉由机械抛光方式除去,也可选择部分抛光。
抛光期间会添加研磨浆料及化学物质,增加抛光率与平坦度。

Product

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

晶圆测试 (Wafer Testing)

对晶圆做各项的测试,确定设计与制程的质量好坏,晶圆出厂前的最后一道防线。
需要测试机,针测机,探针卡三者一体,才能使用。

制程检测/监测

制程检测 (Process Metrology)
测量各制程机台的制程参数,如薄膜厚度、关键尺寸线宽、多层图案对准、蚀刻深度、材料电性与物性等。

Product

Bruker Co. LTD. (美国)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美国)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美国)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Taiwan Electron Microscope Instrument Corporation (台湾)

桌上型扫描电子显微镜与液态检测模组

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

Benchmark Technologies (美国)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

NvisANA (韩国)

晶圆表面不纯物分析设备
Wafer Impurity Contamination Monitoring System

  • M-SPEC 金属不纯物分析
  • I-SPEC 离子不纯物分析
  • O-SPEC 有机不纯物分析
  • GIM/CIM 化学气体/化学品不纯物分析

环境监测 – 气体性分子污染物检测 (Airborne Molecular Contamination Monitoring)
侦测与监控无尘室内环境之可能VOC (Volatile Organic Compounds) 污染源,包括污染气体、制程反应逸散、设备材料本身挥发产生及设备维护过程气体挥发等

Product

Tricorn (台湾)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Tricorn (台湾)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

金属薄膜沉积 (Metal Film Deposition)

以磁控溅射镀膜方式于晶圆表面进行金属镀膜

Product

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

黄光微影 (Photo Lithography)

利用光学投影成像或直接光刻,将电路图案复印至覆盖晶圆表面的光阻材料,以达成图案化。

Product

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

电镀 (Electro-Plating)

电镀是一种电化学沉积过程,经由电解反应把一种金属镀于另一种金属物体的表面。

Product

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

晶圓載具貼合/剝離 (Wafer Bonder/De-bonder)

貼合:將兩片不同功能的晶圓,經對準及貼合技術,使晶片彼此之間完成貼合;在應用上則區分永久性貼合及暫時性貼合。
剝離:將裝置晶圓(Device Wafer)暫時地貼合到一個載具晶圓(Carrier Wafer)上,助其後製程的晶圓薄化處理,完成後製程序之後接續進行剝離程序。

植球 & 回流焊 (Ball Mount & Reflow)

植球将锡球(Solder)植入 IC 脚垫(Pad) 。
回流焊:透过热处理程序熔化焊料,使锡球完全接合于焊垫。

Product

Boston Process Technologies, Inc. (美国)

Fluxless Solder Bumping Processors
无需助焊剂之植球与回焊及其检测

  • Fluxless solder ball mount & rework
  • Fluxless solder reflow
  • Wafer level inspection

制程检测与监控 (Mask Manufacturing)

晶圆表面缺陷检测:
利用光学取得晶圆表面影像,辅以电脑影像处理技术来检出异物或图案异常等瑕疵。

晶圆载具贴合/剥离 (Wafer Bonder/De-bonder)

贴合:将两片不同功能的晶圆,经对准及贴合技术,使晶片彼此之间完成贴合;在应用上则区分永久性贴合及暂时性贴合。
剥离:将装置晶圆(Device Wafer)暂时地贴合到一个载具晶圆(Carrier Wafer)上,助其后制程的晶圆薄化处理,完成后制程序之后接续进行剥离程序。