光罩制作 (Mask Manufacturing)

经由雷射/电子束描绘机将线路图描绘在石英/玻璃基板上,此基板(光罩),会借曝光机投影成像技术,将其线路图成像到晶圆或玻璃基板上。

Product

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

扩散及薄膜 / 离子植入(Diffusion & Thin Film / Ion Implantation)

扩散及薄膜(Diffusion & Thin Film)
用途广泛,应用于扩散、趋入、氧化、薄膜沉积、退火、热烧结
可分为常压、低压沉积、原子层薄膜沉积

离子植入(Ion Implantation)
先利用分析磁場將特定的游離原子或分子篩選出,再利用電場將游離原子或分子加速或減速後植入晶圓。

Product

Advanced Ion Beam Technology, Inc. (台灣)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

湿式蚀刻与清洁 (Wet Etch & Clean)

湿蚀刻
利用药液,将晶圆表面上的图形,做选择性地去除
可分为多反应槽式、单槽式、单晶圆式

清洁
要制作精密的硅晶圆产品,需要非常洁净的表面,才能质量极佳化

黄光微影涂布及显影 (Photo Lithography)

光阻塗佈: 去水烘烤、HMDS塗佈、光阻塗佈、厚PI塗佈、軟烤
将光刻膠由喷嘴喷吐在芯片上,使用旋转载台带动芯片高速旋转后,将光刻膠均匀散布在芯片上

顯影: 曝後烤、顯影、硬烤
将显影液由喷嘴喷吐在芯片上,将光刻膠显影后以DIW(去离子)水加以冲洗,然后再将芯片上的水旋干。

可配合客户压印制程使用

Product

Ast Ltd. (台湾)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

干式蚀刻 (Dry Etch)

利用气体作为反应物,以低压和高能的环境产生电浆,去除硅晶圆表面的薄膜,定义出图形。
可分为物理性、化学性、活性离子。

化学机械研磨 (Chemical-Mechanical Planarization)

将晶片表面之突出部分,藉由机械抛光方式除去,也可选择部分抛光。
抛光期间会添加研磨浆料及化学物质,增加抛光率与平坦度。

Product

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

晶圆测试 (Wafer Testing)

对晶圆做各项的测试,确定设计与制程的品质好坏,晶圆出厂前的最后一道防线。
需要测试机,针测机,探针卡三者一体,才能使用。

Product

Hermes Testing Solutions Inc.

制程检测/监测

制程检测 (Process Metrology)
测量各制程机台的制程参数,如薄膜厚度、关键尺寸线宽、多层图案对准、蚀刻深度、材料电性与物性等。

Product

Bruker Co. LTD. (美国)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美国)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美国)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Taiwan Electron Microscope Instrument Corporation (台湾)

桌上型扫描电子显微镜与液态检测模组

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

Benchmark Technologies (美国)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

NvisANA (韩国)

晶圆表面不纯物分析设备
Wafer Impurity Contamination Monitoring System

  • M-SPEC 金属不纯物分析
  • I-SPEC 离子不纯物分析
  • O-SPEC 有机不纯物分析
  • GIM/CIM 化学气体/化学品不纯物分析

气体性分子污染物检测 (Airborne Molecular Contamination Monitoring)
侦测与监控无尘室内环境之可能AMC污染源,包括污染气体、制程反应逸散、设备材料本身挥发产生及设备维护过程气体挥发等

Product

Tricorn (台湾)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Tricorn (台湾)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

气体杂质浓度(AMC/Particle Filtration)
可以通过客制化学滤网去除进入厂房或设备端AMC问题。
经由由客制高效除尘滤网去除进入厂房或设备端粉尘问题。

Product

钰祥企业股份有限公司
YESIANG Enterprise Co., Ltd.

钰祥企业股份有限公司
YESIANG Enterprise Co., Ltd.

钰祥企业股份有限公司
YESIANG Enterprise Co., Ltd.

钰祥企业股份有限公司
YESIANG Enterprise Co., Ltd.

金属薄膜沉积 (Metal Film Deposition)

以磁控溅射镀膜方式于晶圆表面进行金属镀膜

Product

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

黄光微影 (Photo Lithography)

利用光学投影成像或直接光刻,将电路图案复印至覆盖晶圆表面的光阻材料,以达成图案化。

Product

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

电镀 (Electro-Plating)

电镀是一种电化学沉积过程,经由电解反应把一种金属镀于另一种金属物体的表面。

Product

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

晶圓載具貼合/剝離 (Wafer Bonder/De-bonder)

貼合:將兩片不同功能的晶圓,經對準及貼合技術,使晶片彼此之間完成貼合;在應用上則區分永久性貼合及暫時性貼合。
剝離:將裝置晶圓(Device Wafer)暫時地貼合到一個載具晶圓(Carrier Wafer)上,助其後製程的晶圓薄化處理,完成後製程序之後接續進行剝離程序。

Die Bonder

The cut dies (chips) are placed on the IC substrate to be bonded based on the required bonding speed and accuracy.

Product

Boston Process Technologies, Inc. (United States)

Fluxless Thermo-Compression Bonder & AXI+

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

植球 & 回流焊 (Ball Mount & Reflow)

植球将锡球(Solder)植入 IC 脚垫(Pad) 。
回流焊:透过热处理程序熔化焊料,使锡球完全接合于焊垫。

Product

Boston Process Technologies, Inc. (美国)

Fluxless Thermo-Compression Bonder & AXI+
无须助焊剂热压接合粘合剂黏合机及其检测

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

制程检测与监控 (Mask Manufacturing)

晶圆表面缺陷检测:
利用光学取得晶圆表面影像,辅以电脑影像处理技术来检出异物或图案异常等瑕疵。

晶圆载具贴合/剥离 (Wafer Bonder/De-bonder)

贴合:将两片不同功能的晶圆,经对准及贴合技术,使晶片彼此之间完成贴合;在应用上则区分永久性贴合及暂时性贴合。
剥离:将装置晶圆(Device Wafer)暂时地贴合到一个载具晶圆(Carrier Wafer)上,助其后制程的晶圆薄化处理,完成后制程序之后接续进行剥离程序。

晶片黏合 (Die Bonder)

将已切好的晶片放置在IC基板上,相连之黏着,要求的是黏着的速度,正确度。

Product

Boston Process Technologies, Inc. (美国)

Fluxless Thermo-Compression Bonder & AXI+
无须助焊剂热压接合粘合剂黏合机及其检测

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray