光罩製作 (Mask Manufacturing)

經由雷射/電子束描繪機將線路圖描繪在石英/玻璃基板上,此基板(光罩),會藉曝光機投影成像技術,將其線路圖成像到晶圓或玻璃基板上。

Product

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

擴散及薄膜 / 離子植入(Diffusion & Thin Film / Ion Implantation)

擴散及薄膜(Diffusion & Thin Film)
用途廣泛,應用於擴散、趨入、氧化、薄膜沉積、退火、熱燒結
可分為常壓、低壓沉積、原子層薄膜沉積

離子植入(Ion Implantation)
先利用分析磁場將特定的游離原子或分子篩選出,再利用電場將游離原子或分子加速或減速後植入晶圓。

Product

Advanced Ion Beam Technology, Inc. (台灣)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

濕式蝕刻與清潔 (Wet Etch & Clean)

濕蝕刻
利用藥液,將晶圓表面上的圖形,做選擇性地去除
可分為多反應槽式、單槽式、單晶圓式

清潔
要製作精密的矽晶圓產品,需要非常潔淨的表面,才能品質極佳化

黃光微影塗佈及顯影 (Photo Lithography)

光阻塗佈:去水烘烤、HMDS塗佈、光阻塗佈、軟烤
曝光:以曝光機搭配光罩使用
顯影:曝後烤、顯影、硬烤

乾式蝕刻 (Dry Etch)

利用氣體作為反應物,以低壓和高能的環境產生電漿,去除矽晶圓表面的薄膜,定義出圖形。
可分為物理性、化學性、活性離子。

化學機械研磨 (Chemical-Mechanical Planarization)

將晶片表面之突出部分,藉由機械拋光方式除去,也可選擇部分拋光。
拋光期間會添加研磨漿料及化學物質,增加拋光率與平坦度。

Product

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

晶圓測試 (Wafer Testing)

對晶圓做各項的測試,確定設計與製程的品質好壞,晶圓出廠前的最後一道防線。
需要測試機,針測機,探針卡三者一體,才能使用。

Product

Hermes Testing Solutions Inc.

製程檢測/監測

製程檢測 (Process Metrology)
測量各製程機台的製程參數,如薄膜厚度、關鍵尺寸線寬、多層圖案對準、蝕刻深度、材料電性與物性等。

Product

Bruker Co. LTD. (美國)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美國)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美國)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Taiwan Electron Microscope Instrument Corporation (台灣)

桌上型掃描電子顯微鏡與液態檢測模組

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

Benchmark Technologies (美國)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

NvisANA (韓國)

晶圓表面不純物分析設備
Wafer Impurity Contamination Monitoring System

  • M-SPEC 金屬不純物分析
  • I-SPEC 離子不純物分析
  • O-SPEC 有機不純物分析
  • GIM/CIM 化學氣體/化學品不純物分析

氣體性分子污染物檢測 (Airborne Molecular Contamination Monitoring)
偵測與監控無塵室內環境之可能AMC污染源,包括汙染氣體、製程反應逸散、設備材料本身揮發產生及設備維護過程氣體揮發等

Product

Tricorn (臺灣)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Tricorn (臺灣)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

氣體污染物防治(AMC/Particle Filtration)
藉由客製化學濾網去除進入廠房或設備端AMC問題。
藉由客製高效除塵濾網去除進入廠房或設備端粉塵問題。

Product

鈺祥企業股份有限公司
YESIANG Enterprise Co., Ltd.

鈺祥企業股份有限公司
YESIANG Enterprise Co., Ltd.

鈺祥企業股份有限公司
YESIANG Enterprise Co., Ltd.

鈺祥企業股份有限公司
YESIANG Enterprise Co., Ltd.

金屬薄膜沉積 (Metal Film Deposition)

以磁控濺射鍍膜方式於晶圓表面進行金屬鍍膜

Product

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

黃光微影 (Photo Lithography)

利用光學投影成像或直接光刻,將電路圖案複印至覆蓋晶圓表面的光阻材料,以達成圖案化。

Product

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

電鍍 (Electro-Plating)

電鍍是一種電化學沉積過程,經由電解反應把一種金屬鍍於另一種金屬物體的表面。

Product

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

晶圓載具貼合/剝離 (Wafer Bonder/De-bonder)

貼合:將兩片不同功能的晶圓,經對準及貼合技術,使晶片彼此之間完成貼合;在應用上則區分永久性貼合及暫時性貼合。
剝離:將裝置晶圓(Device Wafer)暫時地貼合到一個載具晶圓(Carrier Wafer)上,助其後製程的晶圓薄化處理,完成後製程序之後接續進行剝離程序。

晶片黏合 (Die Bonder)

將已切好的晶片放置在IC基板上,並將之黏著,要求的是黏著的速度、正確度。

Product

Boston Process Technologies, Inc. (美國)

Fluxless Thermo-Compression Bonder & AXI+
無須助焊劑熱壓接合晶片黏合機及其檢測

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

植球 & 回流焊 (Ball Mount & Reflow)

植球將錫球(Solder)植入 IC 腳墊(Pad) 。
回流焊:透過熱處理程序熔化焊料,使錫球完全接合於焊墊。

Product

Boston Process Technologies, Inc. (美國)

Fluxless Thermo-Compression Bonder & AXI+
無須助焊劑熱壓接合晶片黏合機及其檢測

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

製程檢測與監控 (Mask Manufacturing)

晶圓表面缺陷檢測:
利用光學取得晶圓表面影像,輔以電腦影像處理技術來檢出異物或圖案異常等瑕疵。