光罩製作 (Mask Manufacturing)

經由雷射/電子束描繪機將線路圖描繪在石英/玻璃基板上,此基板(光罩),會藉曝光機投影成像技術,將其線路圖成像到晶圓或玻璃基板上。

Product

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Mycronic AB (瑞典)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

擴散及薄膜 / 離子植入(Diffusion & Thin Film)

擴散及薄膜(Diffusion & Thin Film)
用途廣泛,應用於擴散、趨入、氧化、薄膜沉積、退火、熱燒結
可分為常壓、低壓沉積、原子層薄膜沉積

離子植入(Ion Implanter)
離子佈植:利用電場,將游離的原子或分子加速後,直接射入晶圓的過程
摻雜:在晶圓中加入其他元素,改變材料的導電特性

Product

Advanced Ion Beam Technology, Inc. (台灣)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

濕式蝕刻與清潔 (Wet Etch & Clean)

濕蝕刻
利用藥液,將晶圓表面上的圖形,做選擇性地去除
可分為多反應槽式、單槽式、單晶圓式

清潔
要製作精密的矽晶圓產品,需要非常潔淨的表面,才能品質極佳化

黃光微影塗佈及顯影 (Photo Lithography)

光阻塗佈:去水烘烤、HMDS塗佈、光阻塗佈、軟烤
曝光:以曝光機搭配光罩使用
顯影:曝後烤、顯影、硬烤

乾式蝕刻 (Dry Etch)

利用氣體作為反應物,以低壓和高能的環境產生電漿,去除矽晶圓表面的薄膜,定義出圖形。
可分為物理性、化學性、活性離子。

化學機械研磨 (Chemical-Mechanical Planarization)

將晶片表面之突出部分,藉由機械拋光方式除去,也可選擇部分拋光。
拋光期間會添加研磨漿料及化學物質,增加拋光率與平坦度。

Product

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

晶圓測試 (Wafer Testing)

對晶圓做各項的測試,確定設計與製程的品質好壞,晶圓出廠前的最後一道防線。
需要測試機,針測機,探針卡三者一體,才能使用。

製程檢測/監測

製程檢測 (Process Metrology)
測量各製程機台的製程參數,如薄膜厚度、關鍵尺寸線寬、多層圖案對準、蝕刻深度、材料電性與物性等。

Product

Bruker Co. LTD. (美國)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美國)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (美國)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Taiwan Electron Microscope Instrument Corporation (台灣)

桌上型掃描電子顯微鏡與液態檢測模組

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

Benchmark Technologies (美國)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

NvisANA (韓國)

晶圓表面不純物分析設備
Wafer Impurity Contamination Monitoring System

  • M-SPEC 金屬不純物分析
  • I-SPEC 離子不純物分析
  • O-SPEC 有機不純物分析
  • GIM/CIM 化學氣體/化學品不純物分析

環境監測 – 氣體性分子污染物檢測 (Airborne Molecular Contamination Monitoring)
偵測與監控無塵室內環境之可能VOC (Volatile Organic Compounds) 污染源,包括汙染氣體、製程反應逸散、設備材料本身揮發產生及設備維護過程氣體揮發等

Product

Tricorn (臺灣)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Tricorn (臺灣)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

金屬薄膜沉積 (Metal Film Deposition)

以磁控濺射鍍膜方式於晶圓表面進行金屬鍍膜

Product

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

黃光微影 (Photo Lithography)

利用光學投影成像或直接光刻,將電路圖案複印至覆蓋晶圓表面的光阻材料,以達成圖案化。

Product

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

ORC (日本)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

電鍍 (Electro-Plating)

電鍍是一種電化學沉積過程,經由電解反應把一種金屬鍍於另一種金屬物體的表面。

Product

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (日本)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating 

晶圓載具貼合/剝離 (Wafer Bonder/De-bonder)

貼合:將兩片不同功能的晶圓,經對準及貼合技術,使晶片彼此之間完成貼合;在應用上則區分永久性貼合及暫時性貼合。
剝離:將裝置晶圓(Device Wafer)暫時地貼合到一個載具晶圓(Carrier Wafer)上,助其後製程的晶圓薄化處理,完成後製程序之後接續進行剝離程序。

植球 & 回流焊 (Ball Mount & Reflow)

植球將錫球(Solder)植入 IC 腳墊(Pad) 。
回流焊:透過熱處理程序熔化焊料,使錫球完全接合於焊墊。

Product

Boston Process Technologies, Inc. (美國)

Fluxless Solder Bumping Processors
無需助焊劑之植球與迴焊及其檢測

  • Fluxless solder ball mount & rework
  • Fluxless solder reflow
  • Wafer level inspection

製程檢測與監控 (Mask Manufacturing)

晶圓表面缺陷檢測:
利用光學取得晶圓表面影像,輔以電腦影像處理技術來檢出異物或圖案異常等瑕疵。