黃光微影塗佈及顯影 (Photo-Lithography)

光阻塗佈:去水烘烤、HMDS塗佈、光阻塗佈、厚PI塗佈、軟烤。
顯影:曝後烤、顯影、硬烤
可配合客戶壓印製程使用

Product

Ast Ltd. (臺灣)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

乾式蝕刻 (Dry Etch)

利用氣體作為反應物,以低壓和高能的環境產生電漿,去除藍寶石晶圓表面定義出PSS圖形,及在 Chip 製程中做 GaN 蝕刻。
可分為物理性、化學性、活性離子。

Product

Ast Ltd. (臺灣)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

磊晶 (EPI)

磊晶(Epitaxy)是在拋光晶圓上以延續基材的原子排列方式長出一層薄膜。

Product
  • MOCVD Systems

薄膜 (Thin Film)

在真空的容器中,將欲蒸鍍的材料加熱直至汽化昇華,並使此氣體附著於放置在特定治具的晶圓表面上而形成一層薄膜。

Product

Ast Ltd. (臺灣)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

封膠 (Encapsulation)

利用二流體氣壓霧化方式,將膠材均勻塗佈,亦可混合光色彩轉換材料達到一致的色彩分佈性。

Product
  • Spray Coater