黄光微影涂布及显影 (Photo-Lithography)

光阻涂布:去水烘烤、HMDS涂布、光阻涂布、厚PI涂布、软烤。
显影:曝后烤、显影、硬烤
可配合客户压印制程使用

Product

Ast Ltd. (台湾)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

干式蚀刻 (Dry Etch)

利用气体作为反应物,以低压和高能的环境产生电浆,去除蓝宝石晶圆表面定义出PSS图形,及在 Chip 制程中做 GaN 蚀刻。
可分为物理性、化学性、活性离子。

Product

Ast Ltd. (台湾)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

磊晶 (EPI)

磊晶(Epitaxy)是在抛光晶圆上以延续基材的原子排列方式长出一层薄膜。

Product

  • MOCVD Systems

薄膜 (Thin Film)

在真空的容器中,将欲蒸镀的材料加热直至汽化升华,并使此气体附着于放置在特定治具的晶圆表面上而形成一层薄膜。

Product

Ast Ltd. (台湾)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

封胶 (Encapsulation)

利用二流体气压雾化方式,将胶材均匀涂布,亦可混合光色彩转换材料达到一致的色彩分布性。

Product

  • Spray Coater