Photo-Lithography Coating and Development

Photoresist coating: Dehydration bake, HMDS coating, photoresist coating, thick PI coating, and softbake.
Development: Post-exposure bake, development, and hardbake.
Can be used in conjunction with customer imprinting processes.

Product

Ast Ltd. (Taiwan)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Dry Etch

Using gas as a reactant to generate plasma in a low-pressure and high-energy environment, remove the surface of sapphire substrate to define the PSS pattern, and conduct GaN etching during chip manufacturing.
Can be divided into physical, chemical, and reactive ion etching.

Product

Ast Ltd. (Taiwan)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Epitaxy

Epitaxy refers to forming a thin film on a polished wafer by stretching the atomic alignment of the substrate.

Product

  • MOCVD Systems

Thin Film

In a vacuum container, the material to be evaporated is heated until vaporization and sublimation. Such gas is attached to the surface of the wafer placed on a particular fixture to form a film.

Product

Ast Ltd. (Taiwan)

  • LED E-Beam Evaporator: Metal, ITO Film Evaporator.
  • LED Spin Coater/Developer: Photo Resist Spin Coater/Developer
  • LED Plasma Etcher/Stripper: Sapphire, Mesa ICP Etcher.
  • LED Wafer Bonder

Encapsulation

Two-fluid gas-assisted atomization is used to uniformly coat the adhesive material. The color conversion material can be mixed to achieve uniform color distribution.

Product

  • Spray Coater