Semiconductor and Opto-electronics Equipment and MFG

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

Advanced Ion Beam Technology, Inc. (Taiwan)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (Japan)

  • Ion Implantation: Ion Implanters and Plasma Doping

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Boston Process Technologies, Inc. (United States)

Fluxless Thermo-Compression Bonder & AXI+

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

Hermes-Epitek

  • MOCVD

Components and Materials

Fujikin Incorporated (Japan)

  • Parts: FCS ( Flow Control System ), IGS (Integrated Gas System )

Benchmark Technologies (United States)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

Hermes-Epitek

  • Si parts
  • SiC Ingot, Sic Substrate
  • Chiller (New & Repair)
  • RF, RPS (Remote Plasma Source)

Bio-Medical

  • DNA sensor chip
  • Biochip IVD scanner
  • BNCT treatment
  • Pesticide residue diagnosis
  • Blood pump implant for heart failure patients
  • Electronic eyes and ears
  • Nano wire-FET bio-sensing platform
  • Electronic medicine
  • Cancer immunotherapy
  • Epidemic screen

Energy efficiency

  • WBG semiconductor
  • GaN-based power management technology
  • SiC device design house
  • Automobile turbo charger
  • BLDC motor and control design and manufacturing
  • BLDC MCU + gate drivers + power MOS

AIoT and Life

  • Design and creative
  • Smart wearables
  • Water repellent fabric chemical & process
  • Smart-tinting glass