Mask Manufacturing

The circuit diagram is traced onto a quartz/glass substrate via a laser/electron beam tracer. This substrate (photomask) is imaged onto the wafer or glass substrate by the stepper’s projection imaging technology.

Product

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Diffusion & Thin Film / Ion Implantation

Diffusion & Thin Film
Widely used in diffusion, infiltration, oxidation, film deposition, annealing, and sintering.
Can be divided into standard pressure, low pressure deposition, and atomic layer film deposition.

Ion Implanter
Ion implantation: The process of directly injecting charged atoms or molecules accelerated by an electric field into a wafer.
Doping: Adding other elements to the wafer to change the conductive properties of the material.

Product

Advanced Ion Beam Technology, Inc. (Taiwan)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (Japan)

  • Ion Implantation: Ion Implanters and Plasma Doping

Sumitomo (Japan)

  • Ion Implantation: Ion Implanters and Plasma Doping

Wet Etch & Clean

Wet etch
Using the solvent to selectively remove a pattern on the surface of the wafer.
Can be divided into multi-reaction tank, single-tank, and single-wafer etching.

Clean 
In order to make a high precision silicon wafer product, a very clean surface is required for optimized quality.

Photo-Lithography Coating and Development

Photoresist coating: Dehydration bake, HMDS coating, photoresist coating, and softbake.
Exposure: Using the stepper in coordination with photomask.
Development: Post-exposure bake, development, and hardbake.

Dry Etch

Using gas as a reactant to generate plasma in a low-pressure and high-energy environment, remove the thin film on the surface of the wafer, and define a pattern.
Can be divided into physical, chemical, and reactive ion etching.

Chemical-Mechanical Planarization (CMP)

The protruding part of the surface of the wafer is removed by mechanical polishing, and partial polishing may also be selected.
Planarization slurry and chemical substances are added during polishing to increase polishing rate and flatness.

Product

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

Wafer Testing

Conducting various wafer tests to determine the quality of design and manufacturing. It is regarded as the last line of defense before the wafer shipment.
It can only be done by using the combination of the test handler, prober, and probe card.

Process Metrology

Process Metrology
Process parameters of each machine are measured, such as film thickness, critical dimension line width, multi-layer pattern alignment, etching depth, and material electrical and physical properties.

Product

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Taiwan Electron Microscope Instrument Corporation (Taiwan)

Desktop Scanning Electron Microscope & Liquid-Phase Inspection Modules

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

Benchmark Technologies (United States)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

NvisANA (Korea)

Wafer Impurity Contamination Monitoring System

  • In-Line Wafer Metallic Contamination Monitoring System
  • In-Line Wafer Ionic Contamination Monitoring System
  • In-Line Wafer Organic Contamination Monitoring System
  • Automated Metallic Impurity Monitoring System For Gas and Chemical

Environmental monitoring – Airborne molecular contaminant monitoring
Detecting and monitoring possible sources of volatile organic compounds (VOC) in a clean room environment, including gas contaminants, process escape response, volatilization of equipment materials themselves, and volatilization during equipment maintenance processes.

Product

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Metal Film Deposition

Metal film deposition on the surface of the wafer by magnetron sputtering

Product

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

Photo Lithography

The circuit pattern is copied to the photoresist material covering the surface of the wafer by optical projection imaging or laser direct imaging to achieve patterning.

Product

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

Electro-Plating

Electroplating is an electrochemical deposition process that deposits a metal onto the surface of another metal object via an electrolytic reaction.

Product

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

Wafer Bonder/De-bonder

Two wafers with different functions are aligned and bonded to complete the bonding between them. In terms of application, it can be divided into permanent bonding and temporary bonding.
The device wafer is temporarily bonded to a carrier wafer to facilitate the subsequent wafer thinning process; de-bonding is performed after the completion of post-production.

Ball Mount & Reflow

Mounting the solder ball on the IC pad.
Reflow: The solder is melted through a heat treatment process to completely bond the solder balls to the pads.

Product

Boston Process Technologies, Inc. (United States)

Fluxless Solder Bumping Processors

  • Fluxless solder ball mount & rework
  • Fluxless solder reflow
  • Wafer level inspection

Process Metrology and Monitoring

Wafer surface defect inspection:
The wafer surface image is optically captured, and computer image processing technology is used to detect foreign object or pattern anomalies.