Mask Manufacturing

The circuit diagram is traced onto a quartz/glass substrate via a laser/electron beam tracer. This substrate (photomask) is imaged onto the wafer or glass substrate by the stepper’s projection imaging technology.

Product

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Mycronic AB (Sweden)

  • Leading supplier of production solutions to the electronics industry
  • Pattern Generators: Display, Semiconductor, Touch Panels and Advanced Packaging
  • Surface Mount Technology Equipment: Placement, Jet Printing and Component Storage

Diffusion & Thin Film/Ion implantation

Diffusion & Thin Film
用途廣泛,應用於擴散、趨入、氧化、薄膜沉積、退火、熱燒結
可分為常壓、低壓沉積、原子層薄膜沉積

Ion Implantation
First, magnetic field analysis module is used to select specific ionized atoms or molecules. Then, these ionized atoms or molecules are accelerated or decelerated by an electric field to be implanted on the wafer.

Product

Advanced Ion Beam Technology, Inc. (台灣)

  • Ion Implantation: Ion Implanter (A Hermes-Epitek subsidiary company)

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Sumitomo (日本)

  • Ion Implantation: Ion Implanters and Plasma Doping

Wet Etch & Clean

Wet etch
Using the solvent to selectively remove a pattern on the surface of the wafer.
Can be divided into multi-reaction tank, single-tank, and single-wafer etching.

Clean 
In order to make a high precision silicon wafer product, a very clean surface is required for optimized quality.

Photo-Lithography Coating and Development

Photoresist coating: Dehydration bake, HMDS coating, photoresist coating, and softbake.
Exposure: Using the stepper in coordination with photomask.
Development: Post-exposure bake, development, and hardbake.

Dry Etch

Using gas as a reactant to generate plasma in a low-pressure and high-energy environment, remove the thin film on the surface of the wafer, and define a pattern.
Can be divided into physical, chemical, and reactive ion etching.

Chemical-Mechanical Planarization (CMP)

The protruding part of the surface of the wafer is removed by mechanical polishing, and partial polishing may also be selected.
Planarization slurry and chemical substances are added during polishing to increase polishing rate and flatness.

Product

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

Tung An Development LTD.

Tung An Development Limited was established to provide business of PVA products on February, 2003. This company is responsible for the development of many types of special synthetic plastic and rubber material as well as manufacturing processes for its customers. Its goals are to enhance quality, solve the customers’ problems, and pursue excellence in the industry.

Wafer Testing

Conducting various wafer tests to determine the quality of design and manufacturing. It is regarded as the last line of defense before the wafer shipment.
The testing process can only be done by using the combination of the test handler, prober, and probe card.

Product

Hermes Testing Solutions Inc.

Process Metrology

Process Metrology
Process parameters of each machine are measured, such as film thickness, critical dimension line width, multi-layer pattern alignment, etching depth, and material electrical and physical properties.

Product

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Bruker Co. LTD. (United States)

X-ray Based Metrology and Elemental Analysis solutions

  • AFM (Atomic Force Microscope)
  • X-ray Metrology Solutions
  • Micro & Nano CT
  • Optical Metrology Solutions

Taiwan Electron Microscope Instrument Corporation (Taiwan)

Desktop Scanning Electron Microscope & Liquid-Phase Inspection Modules

  • Desktop SEM & Liquid-Phase Inspection Modules
  • BEI + STEM analysis
  • Energy dispersive X-ray spectrometer (EDS) for elemental analysis
  • Software for 3D view and surface roughness measurement functions

Benchmark Technologies (United States)

  • Lithography: Reticles/Masks; Focus Analysis tool; Software

NvisANA (Korea)

Wafer Impurity Contamination Monitoring System

  • In-Line Wafer Metallic Contamination Monitoring System
  • In-Line Wafer Ionic Contamination Monitoring System
  • In-Line Wafer Organic Contamination Monitoring System
  • Automated Metallic Impurity Monitoring System For Gas and Chemical

Airborne molecular contaminant monitoring
Detecting and monitoring possible sources of AMC in a clean room environment, including gas contaminants, process escape response, volatilization of equipment materials themselves, and volatilization during equipment maintenance processes.

Product

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Tricorn (Taiwan)

  • VOC / AMC detector in manufacturing environment with sub-ppb level of capability.

Airborne Molecular Contamination (AMC)/Particle Filtration
Removal of AMC entering the plant or equipment by customized chemical filters.
Removal of powder particles entering the plant or equipment by customized, high-efficiency dust filters.

Product

YESIANG Enterprise Co., Ltd.

YESIANG Enterprise Co., Ltd.

YESIANG Enterprise Co., Ltd.

YESIANG Enterprise Co., Ltd.

Metal Film Deposition

Metal film deposition on the surface of the wafer by magnetron sputtering

Product

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

Photo Lithography

The circuit pattern is copied to the photoresist material covering the surface of the wafer by optical projection imaging or laser direct imaging to achieve patterning.

Product

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

ORC (Japan)

  • Stepper : Bump, Cu Post, RDL, TSV
  • lamp : UV lamp

Optical Associates Inc.

OAI is a Silicon Valley-based manufacturer of advanced precision equipment for the Solar, Photovoltaic, Semiconductor, MEMS, and Microfluidics Industries.

  • Mask Aligner
  • UV meter & Probes

Electro-Plating

Electroplating is an electrochemical deposition process that deposits a metal onto the surface of another metal object via an electrolytic reaction.

Product

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

ASMPT

ASM Pacific Technology Limited (ASMPT) is a leading integrated solutions provider in Semiconductor and Electronics industries. We have three business segments – Back-end Equipment, Materials, and NEXX Products….

EBARA corporation (Japan)

  • CMP: Metal, Dielectric CMP
  • Plating: Metal plating

Wafer Bonder/De-bonder

Two wafers with different functions are aligned and bonded to complete the bonding between them. In terms of application, it can be divided into permanent bonding and temporary bonding.
The device wafer is temporarily bonded to a carrier wafer to facilitate the subsequent wafer thinning process; de-bonding is performed after the completion of post-production.

晶片黏合 (Die Bonder)

将已切好的晶片放置在IC基板上,相连之黏着,要求的是黏着的速度,正确度。

Product

Boston Process Technologies, Inc. (美国)

Fluxless Thermo-Compression Bonder & AXI+
无须助焊剂热压接合粘合剂黏合机及其检测

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

Ball Mount & Reflow

Mounting the solder ball on the IC pad.
Reflow: The solder is melted through a heat treatment process to completely bond the solder balls to the pads.

Product

Boston Process Technologies, Inc. (United States)

Fluxless Thermo-Compression Bonder & AXI+

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray

Process Metrology and Monitoring

Wafer surface defect inspection and measurement:
The wafer surface image is optically captured, and computer image processing technology is used to detect foreign object or pattern anomalies.

Product

V5 Technologies

Leading Company of AI and Image Processing Technologies

  • Automated OM
  • AI ADC
  • 2D AOI (Automated Optical inspection)

V5 Technologies

Leading Company of AI and Image Processing Technologies

  • Automated OM
  • AI ADC
  • 2D AOI (Automated Optical inspection)

V5 Technologies

Leading Company of AI and Image Processing Technologies

  • Automated OM
  • AI ADC
  • 2D AOI (Automated Optical inspection)

Die Bonder

The cut dies (chips) are placed on the IC substrate to be bonded based on the required bonding speed and accuracy.

Product

Boston Process Technologies, Inc. (United States)

Fluxless Thermo-Compression Bonder & AXI+

  • Fluxless (Thermo-Compression) Gang Bonder
  • InXpection 2.5D X-ray