{"id":23576,"date":"2024-10-18T10:09:58","date_gmt":"2024-10-18T02:09:58","guid":{"rendered":"https:\/\/www.hermes.com.tw\/product\/fluxless-thermal-compression-gang-bonder\/"},"modified":"2024-12-31T10:35:18","modified_gmt":"2024-12-31T02:35:18","slug":"fluxless-thermal-compression-gang-bonder","status":"publish","type":"product","link":"https:\/\/www.hermes.com.tw\/en\/product\/fluxless-thermal-compression-gang-bonder\/","title":{"rendered":"Fluxless Thermal Compression Gang Bonder"},"content":{"rendered":"<div class=\"flex max-w-full flex-col flex-grow\">\n<div class=\"min-h-8 text-message flex w-full flex-col items-end gap-2 whitespace-normal break-words [.text-message+&amp;]:mt-5\" dir=\"auto\" data-message-author-role=\"assistant\" data-message-id=\"ff8401a5-76bf-4c0a-ba17-76a9dc04f960\" data-message-model-slug=\"gpt-4o\">\n<div class=\"flex w-full flex-col gap-1 empty:hidden first:pt-[3px]\">\n<div class=\"markdown prose w-full break-words dark:prose-invert light\">\n<p>Hermes-Epitek&#8217;s flux-free multi-chip hot-press bonding machine is designed for high-performance, high-precision, and environmentally friendly processes. It enables simultaneous bonding of multiple dies, featuring exceptional high-precision alignment capabilities. With multiple high-resolution cameras, it is able to ensure accuracy of \u00b12\u03bcm or beyond. The equipment is capable of high-speed heating and cooling, which significantly shortens the process time and increases production capacity. It is suitable for advanced packaging applications such as CoWoS, HBM, and CSP.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-21128 size-full\" src=\"https:\/\/www.hermes.com.tw\/wp-content\/uploads\/Bonding-1-T-2-1.jpg\" alt=\"\" width=\"1910\" height=\"1073\" srcset=\"https:\/\/www.hermes.com.tw\/wp-content\/uploads\/Bonding-1-T-2-1.jpg 1910w, https:\/\/www.hermes.com.tw\/wp-content\/uploads\/Bonding-1-T-2-1-1000x562.jpg 1000w, https:\/\/www.hermes.com.tw\/wp-content\/uploads\/Bonding-1-T-2-1-768x431.jpg 768w, https:\/\/www.hermes.com.tw\/wp-content\/uploads\/Bonding-1-T-2-1-1536x863.jpg 1536w\" sizes=\"auto, (max-width: 1910px) 100vw, 1910px\" \/><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Hermes-Epitek&#8217;s flux-free multi-chip hot-press bonding machine is designed for high-performance, high-precision, and environmentally friendly processes. It enables simultaneous bonding of multiple dies, featuring exceptional high-precision alignment capabilities. With multiple high-resolution cameras, it is able to ensure accuracy of \u00b12\u03bcm or beyond. The equipment is capable of high-speed heating and cooling, which significantly shortens the process [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":17204,"template":"","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"show_p_home":[108],"class_list":["post-23576","product","type-product","status-publish","has-post-thumbnail","hentry","show_p_home-homeshow"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Fluxless Thermal Compression Gang Bonder - Hermes-Epitek<\/title>\n<meta name=\"robots\" content=\"noindex, follow\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Fluxless Thermal Compression Gang Bonder - Hermes-Epitek\" \/>\n<meta property=\"og:description\" content=\"Hermes-Epitek&#8217;s flux-free multi-chip hot-press bonding machine is designed for high-performance, high-precision, and environmentally friendly processes. 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