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| Chemical Mechanical Polish Tool |
| F-REX300 / F-REX300S |
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200mm/300mm |
| The F*REX series features dry-in/dry-out handling and incorporates besides the polishing modules as well wafer cleaning modules, In-line Metrology tool, high accuracy EPD system, and CLC system. |
- High WPH, Reliability
- Excellent planation capability
- Flexibility in serial or parallel polishing operation for different application
- Capable for low K process
- 30% market share of CMP semiconductor tool
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